Budatec GmbH develops equipment for the semiconductor and photovoltaics industries. Based in Berlin, Germany, budatec has more than 20 years of experience in developing vacuum soldering technologies ranging from small R&D furnaces to fully automated soldering systems. They are a technological leader in this segment specializing in the use of hydrogen and plasma gases.

Budatec offers the smallest and most powerful generation of vacuum soldering systems available on the market today. We offer the following budatec systems:

MODEL 6500: Automatic, High Accuracy Die Attach System

FEATURES:

• Performs Advanced & Complex Die Attach Processes with Very High
• Placement Accuracy
• Very Large Work Area
• Unmatched Versatility
• Performs Room Temperature & Heated Processes Including: Epoxy,
• Eutectic, Thermo-Sonic, Thermo-Compression, ACF/ACP, NCF/NCP, Flip Chip, DAF, Ag Sintering & More
• Handles Active & Passive Components Between 0.15 mm up to over 50 mm
• Specializing in Complex Applications: Combined Processes, Unusual Die Sizes & Aspect Ratios, Very Large Number of Components, etc.
• User-Friendly Graphic Interface Enables Switching Processes in Seconds
• Plug & Play Hardware
• Fully Automatic with Optional Manual Load/Unload for Easy Operation

MODEL 6200: Automatic Die Attach System, The Crossover

FEATURES:

• Small & Unique Table-Top Configuration
• Offers Best Price/Performance
• “Crossover” System with Unmatched Versatility & Very High Placement Accuracy
• Performs a Very Wide Range of Cold & Heated Processes on the Same Machine
• Optimally Handles High-Mix Applications with Minimal Change-Over Time
• User-Friendly Graphic Interface Enables Switching Processes in Seconds
• Plug & Play Hardware
• Fully-Automatic & Semi-Automatic Process Allowing Ultimate Flexibility & Ease of Operation