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Tag: ag sintering

Home Posts Tagged "ag sintering"

Boschman Expands Ag-Sinter Market Share

December 17, 2018Site Managerag sinter, ag sintering, boschman, electronic vehicle power, ev power, power modules, sinter systems

Boschman Technologies – recently re-branded as Boschman Advanced Packaging Technologies – just announced a milestone in the ag-sinter market for electrical vehicles.  NDC International represents Boschman, an innovative company founded in 1987 and located in the Netherlands.  Boschman is a high-end niche player within the semiconductor packaging equipment sector providing full production solutions specifically in…

APC Develops SiC Power Module for Tesla Model 3

November 7, 2018Site Managerag sintering, APC, SiC

NDC International represents APC (Advanced Packing Center) in the Eastern United States.  APC is a Dutch company founded by Boschman Technologies in 2010.  APC focuses on highly innovative packaging solutions for MEMs, Sensors, Powers and IC’s. They provide a wide range of packaging services and support from concept-design to transfer to mass production. Tesla’s adoption…

Discover Silver Sintering at SEMICON West!

June 28, 2018Site Managerag sintering, boschman, boschman technologies, semicon west, silver sintering, sintering

Silver Sintering is an exciting new technology that has captured the interest of our customers this year.  We are now representing Boschman Technologies – a company with a reputation for innovation which specializes in the development and supply of advanced Film-Assisted Molding (FAM) and Sintering Systems for electronic assembly industries across the globe. Boschman has…

Neu Dynamics at iMaps New England

April 16, 2018Site Managerag sintering, boschman, boschman technologies, film assist molding, imaps, silver sintering, sintering, sintering systems

The iMAPS New England 45th Symposium & Expo will be held on May 1, 2018 in Boxborough, Massachusetts.  The theme is “Into the Future Autonomously” and the Symposium will feature a keynote by Chris Jacobs the Vice President of Autonomous Transportation & Safety at Analog Devices, Incorporated.  Come join us and learn more about the…

silver-sintering-boschman

Silver Sintering for Electronic & Semiconductor Applications

January 29, 2018Site Managerag sintering, boschman, silver sintering, sintering

Reliability of Ag-Sintering Bonding Technology Through a relationship announced a few months ago, NDC International is now representing Boschman Technologies in the Eastern USA.  Boschman, based in the Netherlands, has been a high-end niche player in the semiconductor packaging equipment industry since 1987.  They specialize in the development of advanced Film-Assisted Molding (FAM) and silver…

NDC Now Representing Boschman Technologies

November 7, 2017Site Managerag sintering, boschman, film assisted molding, silver sintering, sintering

NDC International Representing Boschman Technologies in the Eastern USA We are very proud to announce our new relationship with Boschman Technologies.  NDC International will now be representing Boschman in the Eastern USA.  We are especially excited about Boschman’s reputation for innovation and the resulting advanced systems they offer.  Boschman specializes in the development of advanced…

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