• About Us
  • Products
    • Boschman Technologies
      • Film Assist Molding Systems
      • Sintering Systems
      • Package Development by Boschman
    • Molding Presses
      • Pre-Owned Molding Presses
    • RF Preheaters
      • New RF Preheaters
      • Pre-Owned RF Preheaters
    • Laser Systems
      • FA Laser Systems
      • HANMI Laser Systems
      • KOSES Flipchip Laser Marking System
    • Vision Inspection Systems
      • HANMI Vision Inspection Systems
      • FA Vision Inspection Systems
    • Die Attach / Sort Systems
      • HANMI Semiconductor Die Attach / Sort Systems
      • MicroAssembly Technologies, Ltd. (MAT)
    • HANMI Semiconductor Vision Placement Systems
    • Manual Wire Bonders
    • Molds & Dies
    • Contract Molding
    • Test Handlers
    • FA Systems Automation
    • Dicing Saw Blades
    • Capillaries
    • Trim Form Dies & Presses
      • HANMI Trim Form Dies & Presses
      • Neu Dynamics Trim Form Dies & Presses
    • Pick and Place
    • Budatec
    • KOSES (Korea Semiconductor System)
  • Parts & Service
  • Blog
  • Get A Quote
  • Contact
    • Management & Sales Team
    • Careers

NDC International has served companies like you – in the business of manufacturing electronic equipment – since 2003. We are distributors of manufacturing equipment for semiconductor packaging, handling and assembly. We offer you manufacturing machinery and equipment from leading companies around the globe including HANMI and FA Systems.

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Contact Information

110 Steamwhistle Drive, Ivyland PA 18974, USA

(800) 910-8150

(215) 355-2460

sales@neudynamics.com

(215) 355-7365

Mon – Fri: 9:00 – 6:00 EST

Copyright 2026 NDC International.