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Manual Wire Bonders

Home Products Manual Wire Bonders

NDC International represents the MPP (Micro Point Pro LTD) line of manual wire bonders in the USA, Mexico and Canada.

The long time leader in wire bonding technology, K&S recently sold the Manual Wire Bond business unit to MPP.  The newest line is the iBond5000 Series and is based on the 4500 Series which was a market leader for over a decade.

We offer the following manual wire bonders from MPP:

ibond_5000_Ball (1)

MPP Ball Bonder: Model iBond 5000 Ball

FEATURES

Provides the High Yields and Excellent Repeatability Needed for All Gold Ball Bonding Applications Including:

  • Optoelectronic modules
  • Hybrid/MCMs
  • Microwave products
  • Discrete devices/lasers

Semi-Automatic/Manual Mode with ‘Z’ Option

‘Z’ Axis DC Servo Motion with Closed-Loop Control

Consistent Ball Size Via Negative Electronic Flame-Off

Missing Ball Detection & Auto-Stop

Deep Access Capability

Built-In Temperature Controller

Various Microscope and Spotlight Targeting Options Available

Large 6” x 6” Bonding Area

Variety of Wire Types: Gold & Copper (with copper kit option)

Chessman/Mouse & Manual ‘Z’ Convertible Right or Left

Ball Bonding, Bumping, Coining, Security Bond & Tab

PDF Spec Sheet
ibond_5000_Ball (1)

MPP Wedge Bonder: Model iBond 5000 Wedge

FEATURES

Provides the High Yield and Excellent Repeatability Needed for Every Wedge Bonding Application Including:

  • Optoelectronic Modules
  • Hybrid/MCMs
  • Microwave Products
  • Discrete Devices/Lasers
  • Chip-on-Boards
  • Leads
  • Sensors
  • High Power Devices

Built-In Temperature Controller

Semi-Automatic/Manual Mode with ‘Z’ Option

Designed for Aluminum Wire, Gold Wire, Ribbon & Copper

Large 5.3” x 5.3” Bonding Area

Deep Access Capability (optional)

‘Z’ Axis DC Servo Motion with Closed-Loop Control

Wide Range of Microscopes and Optical Accessories Available

RoHS Compliant

Chessman/Mouse & Manual ‘Z’ Convertible Right or Left

Bonding Types: Wedge, Tab, Stitch & Ribbon

PDF Spec Sheet
ibond_5000_Ball (1)

MPP Dual Wedge and Ball Bonder: Model iBond 5000 Dual

FEATURES

One Machine, Dual Function Capabilities

Provides the High Yield and Excellent Repeatability Needed for Every

Wedge Bonding Application

Wedge-Wedge and Ball-Wedge Bonding on the Same Machine

Semi-Automatic/Manual Mode with ‘Z’ Option

Fast Changeover by Operator with No Tools

Special K&S Proprietary Transducer for Proper Bond Tool Mounting

Ball Bonding Capillary Mounts with Split Clamp

90-Degree Deep Access Wedge Bonding with 12.5 mm ‘Z’ Axis Travel

Ball Bonding with 12.5 mm ‘Z’ Axis Travel

  • Special K&S proprietary swing arm EFO/Drag arm assembly

High-End Negative EFO with Missing Ball Detection

High-Q 60kHz Ultrasonic Transducer, optional 120kHz

2 Channel Independent Bonding Parameters

Built-In Digital Work Stage Temperature Control

PDF Spec Sheet

About Us

 

NDC International has served companies like you - in the business of manufacturing electronic equipment - since 2003. We are distributors of manufacturing equipment for semiconductor packaging, handling and assembly. We offer you manufacturing machinery and equipment from leading companies around the globe including HANMI and FA Systems.

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110 Steamwhistle Drive, Ivyland PA 18974, USA

(800) 910-8150 or (215) 355-2460

sales@neudynamics.com

(215) 355-7365

Mon - Fri: 9:00 - 6:00 EST

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