Boschman Technologies specializes in the development of advanced Film-Assisted Molding (FAM) and sintering systems for electronic assembly industries across the globe.

Based in the Netherlands, Boschman has been a high-end niche player within the semiconductor packaging equipment industry since 1987. They specialize in transfer-molding and silver sintering die-attach production solutions for semiconductor packaging with a focus on smartcards, sensors, medical, optical and power devices. Boschman Technologies is known for innovation – they have developed several patented technologies that provide state-of-the-art packaging solutions for complex, advanced and demanding sensors and chips.

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