NDC International (NDCI) can help you build the manufacturing capacity you need for future growth using one central resource. NDCI is a company with a new approach to offering turnkey solutions for our clients. Learn More.
NDC International has served companies like you – in the business of manufacturing electronic equipment – since 2003. We are distributors of manufacturing equipment for semiconductor packaging, handling and assembly. Learn more.
NDC International and Neu Dynamics Corporation recently attended the 49th Annual International Symposium on Microelectronics in Pasadena, California on October 11th and 12th, 2016. The show was very successful… Read More
MPP (Micro Point Pro LTD) has been a leading supplier of wire bonding machinery for over 40 years! MPP has a long-standing reputation for precision, innovation and quality. They offer wire bonding tools, high-precision expendable tools, probe head solutions, and special coatings for the semiconductor and microelectronic device assembly industry. NDC International proudly represents the…
Kulicke & Soffa (K&S) serves the automotive, consumer, communications, computing and industrial markets as a top provider of semiconductor and electronic assembly solutions. The company was established in 1951 and in 1971 became one of the first technology companies listed on the NASDAQ. NDC International is the North American distributor for K&S brand dicing blades…
We are proud to represent Boschman Package Development. Based in the Netherlands, Boschman has been a leading high-tech player in the semiconductor packaging equipment industry since 1987. Package Development by Boschman offers package technology research, package development, qualification, prototyping as well as small to medium volume manufacturing services. They can manufacture products in quantities of…
