FA Systems Laser Enclosures Exceed Expectations

NDC International has long offered systems from FA Systems Automation (FASA). Based in Singapore and established in 1988, FA Systems Automation serves the global semiconductor industry offering customized manufacturing solutions. Their flexible manufacturing systems are designed to be adaptable to changes in the product giving manufacturers an advantage in a rapidly changing manufacturing environment. FASA’s…
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We’re Taking on the EV Market!

Neu Dynamics and NDC International were recently featured in an article in MoldMaking Technology by Christina Fuges entitled, “Thermoset Mold Builder Takes on the EV Market.”  The article highlights our unique capabilities and depth of experience.  With the explosion of the EV market globally, there is a huge increase in the need for tooling and…
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Featuring: Teikoku Taping System (TTS)

NDC International is proud to announce our relationship with Teikoku Taping System Co., Ltd (TTS). The company was founded in 1995 and is a wholly owned subsidiary of Nippon Kayaku Co., Ltd. TTS is committed to creating a better future and contributing to society with unique technologies and products.  They strive to provide customers with…
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HANMI micro SAW Offers Superior Reliability & Productivity

NDC International has represented HANMI’s full equipment line for decades! For over 40 Years HANMI Semiconductor has focused on building partnerships and investing in a sustainable future, earning them a leading position in the semiconductor equipment industry for their design, development and manufacturing. HANMI Now World-Leader in Dual-Chuck Saws In June HANMI announced completion of…
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In Memory of Dave Campbell

It is with deep sadness that the team at Neu Dynamics says goodbye to Dave Campbell, Senior Vice President and co-owner of NDC International since 2003.  Dave passed away peacefully on June 16th in Yardley, PA.  He was 81 years old. Dave founded and owned ESC (Equipment for Semiconductors) in 1980 and ran that business…
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Boschman Package Development – Leaders in SiC Power Modules

Boschman Package Development is a Dutch company that develops industry-defining packaging solutions for MEMs, sensors, power devices and medical/optical products. They provide a wide range of services and support from concept-design, to transfer, to mass production. NDC International represents Boschman Package Development in the Eastern United States. Boschman – Leader in Silver Sintering Technology Boschman…
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Best-In-Class Manual Wire Bonders from MPP

MPP (Micro Point Pro LTD) has been a leading supplier of wire bonding machinery for over 40 years!  MPP has a long-standing reputation for precision, innovation and quality.  They offer wire bonding tools, high-precision expendable tools, probe head solutions, and special coatings for the semiconductor and microelectronic device assembly industry.  NDC International proudly represents the…
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K&S: New Generation Hub Blades for Silicon Wafer Dicing

Kulicke & Soffa (K&S) serves the automotive, consumer, communications, computing and industrial markets as a top provider of semiconductor and electronic assembly solutions.  The company was established in 1951 and in 1971 became one of the first technology companies listed on the NASDAQ. NDC International is the North American distributor for K&S brand dicing blades…
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Package Development for Power Modules

We are proud to represent Boschman Package Development.  Based in the Netherlands, Boschman has been a leading high-tech player in the semiconductor packaging equipment industry since 1987. Package Development by Boschman offers package technology research, package development, qualification, prototyping as well as small to medium volume manufacturing services. They can manufacture products in quantities of…
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Film Assisted Molding Technologies for BioMEMS

If you read our last blog you know that Yole Développement is forecasting significant growth in the bioMEMS market predicting growing from $3.7 billion in 2019 to $6.3 billion by 2025. BioMEMS are sensors and microfluidic devices that are integrated into medical equipment utilizing micro-sensors, transducers, actuators, and electronic components.  They are frequently used in…
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