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HANMI’s Package Singulation Saw – The micro SAW P2101

HANMI’s Rapid Development of the micro SAW Line Founded in Korea in 1980, HANMI Semiconductor has grown to become a top developer and manufacturer of semiconductor manufacturing equipment.  They enjoy the highest reputation grounded in their focus on quality improvement, efficiency, R&D, innovative technologies and service. NDC has been representing HANMI for decades!  It has…
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Superior Test Handlers from FA Systems

FA Systems Test Handlers Deliver Reliability & Performance NDC International is proud to represent FA Systems Automation (FASA).  For 35 years FASA has been empowering innovation through manufacturing excellence.  FASA specializes in flexible systems that are designed to adapt – giving manufacturers an advantage in a rapidly evolving manufacturing environment. Their mission is to deliver…
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MAT 6200 Die Attach System– Simple is Better

See the MAT 6200 Die Attach System at iMAPS – Booth #402! MAT has 35 years of experience… and it shows!  In systems that are simple and better.  NDC is proud to represent MicroAssembly Technologies, Ltd. (MAT) in the USA, Canada and Mexico. MAT specializes in complex, high-value applications for microelectronics assembly. Their focus is…
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Budatec’s Innovative Vacuum Soldering Systems

Budatec GmbH has over 30 years of experience in vacuum soldering technology. Based in Berlin, they offer vacuum soldering and sintering systems ranging from small R&D to fully automated systems. They have a global distribution network focusing on North America, Europe and Japan. With the advent of power electronics, laser and CPV applications, a new…
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Great Deals on MPP Wire Bonders!

Are you in the market for a wire bonder?  Looking to replace a used or outdated wire bonding machine?  MPP (Micro Point Pro LTD) is offering great trade-in credits and a 10% promotional discount to universities. Why Choose MPP Wire Bonders? MPP truly is the market leader!  They have an installed base of over 9,000…
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Cutting Edge Sintering Technologies from Boschman

Since 2014 when Boschman was first to market with their manual industrial sinter platform – the Sinterstar Innovate-F-XL – it has been exciting to watch this company with its HQ in the Netherlands grow as a leader in their field. NDC International is proud to represent Boschman Advanced Packaging Technologies in the Eastern United States.…
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NDC’s Contract Molding Team is Here to Help

For over 20 years Neu Dynamics Corporation (NDC) has been offering a level of expertise in contract molding services that sets us above the rest!  We have a dedicated Contract Molding Team that is ready to assist you in achieving your needs on schedule, at the lowest possible price and with the best quality materials. …
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Now Representing KOSES

Neu Dynamics is proud to represent Korea Semiconductor System (KOSES) in North America.  Founded in 1990, KOSES manufactures semiconductor backend equipment for display industries including FPD, Touch Panel, LED, Solar, PCB and general semiconductor industry. KOSES is a leader in the global semiconductor market with a clear vision and challenging spirit.  They leverage 3 decades…
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MAT Die Attach – Next Level Value & Flexibility

NDC represents MicroAssembly Technologies, Ltd. (MAT) in the USA, Canada and Mexico.  MAT provides proven, simple solutions for your complex die attach applications.  They leverage their 35 years of experience to bring you die attach machines with unmatched versatility and lowest cost of ownership. MAT specializes in complex, high-value applications for microelectronics assembly. Laser Focus…
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HANMI Wafer micro SAW: Maximized Productivity & Precision Accuracy

NDC is proud to represent HANMI Semiconductor – one of the top semiconductor equipment companies in the world.  We have enjoyed keeping you informed of their rapid and continual innovations in their award-winning micro SAW line which launched in 2021 and now offers 6 models. Wafer micro SAW Innovation HANMI showcased their latest micro SAW…
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