Meet Powertrim Technologies

Leading the Way in Trim & Form Systems for Power Modules In June of 2024, Trim Form Automation (TFA) Europe and Include Industries launched a new semiconductor back-end equipment company called Powertrim Technologies. The company grew out of Tooling Specialist Derksen (TSD) – a respected supplier of precision mechanical parts and tools with over 20…
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Powerful Vacuum Soldering Systems from Budatec

If you are in the market for a vacuum soldering system, don’t miss the opportunity to meet budatec at the iMAPS show in Boston starting October 3rd. Budatec GmbH is a technology leader serving the semiconductor, photovoltaic, automotive and medical industries worldwide.  Based in Berlin, budatec has 30 years of experience and offers vacuum soldering…
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ESTEK Group – Performance & Quality

NDC International is pleased to announce that we are partnering with ESTEK Group to distribute their CMOS Imaging Sensor Inspection System, as well as their Die Sorter in North America. ESTEK was founded in 2015 and offers advanced optical inspection for the semiconductor industry.  Based in Malasia, they are an innovative vision and handling system…
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New Test Handlers from FA Systems

We are pleased to announce that FA Systems Automation (FASA) has expanded their test handler line! Known for their reliability and performance, the FASA test handlers now include 2 new models for a total of 8 systems to meet your needs. NDC International is proud to represent FASA – a company that has been empowering…
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Sinterstar Mini – Fast, Flexible & Practical

Our partner Boschman has long led the way in sintering technology and continues to be a supplier of top choice whether you engage in small batch or large-scale production. We are pleased to feature the new launch of their innovative Sinterstar Mini.  This system is unique, versatile and ideal for R&D and prototyping. It offers…
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NDC – More than Meets the Eye!

As one of our current customers or contacts you may know us for molds and molding presses, but did you know we also specialize die attach systems?  In fact, we provide the full range of solutions you need for backend semiconductor processing and electronics encapsulation.  Over the last 20 years, we have become one of…
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Leading Ag-Sintering Technologies from Boschman

Boschman has been leading the way in sintering technologies since 2014 when they introduced the groundbreaking Sinterstar Innovate-F-XL. The company, based in the Netherlands, specializes in advanced transfer molding and sintering systems. NDC International represents Boschman Advanced Packaging Technologies in the Eastern United States. Ag-Sintering Improves Performance & Longevity New technologies have been developed to…
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Maximize Your Productivity with the HANMI Wafer micro SAW

HANMI’s innovative micro SAW line was launched in 2021 and now offers 8 models! For our customers specializing in wafer dicing and package/panel cutting, the HANMI wafer micro saw is of particular interest because of its incredible accuracy and ease of use.  This full-automation micro SAW for wafer cutting is a standalone 12-inch model that…
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HANMI’s TC Bonder Line Continues Expansion

HANMI is always at the leading edge of innovation.  That’s why we were not surprised that they were among the first companies to develop a TC bonder (thermal compression bonder).  These machines, which bond individual chips on processed wafers, are in increasing demand driven by the introduction of high-bandwidth memory (HBM) and DDR5. DUAL TC…
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HANMI’s Package Singulation Saw – The micro SAW P2101

HANMI’s Rapid Development of the micro SAW Line Founded in Korea in 1980, HANMI Semiconductor has grown to become a top developer and manufacturer of semiconductor manufacturing equipment.  They enjoy the highest reputation grounded in their focus on quality improvement, efficiency, R&D, innovative technologies and service. NDC has been representing HANMI for decades!  It has…
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