Vacuum Soldering Systems that Increase Your Yield

If you are attending iMAPS in Boston this October, you will want to check out budatec’s line of vacuum soldering systems at the show!  Budatec GmbH has decades of experience and is a top machinery manufacturer for the solar and semiconductor industries.  They specialize in vacuum soldering and solder-free sintering systems with hard and soft…
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TFA Flex Line: Trim & Form System for Power Modules

We are pleased to inform you that NDC is now representing Trim Form Automation (TFA) Europe! TFA Europe is focused on addressing the challenges in power module trim and form automation. The company grew out of Tooling Specialist Derksen (TSD).  TSD is a respected supplier of precision mechanical parts and tools with over 20 years…
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HANMI micro SAW Leads the Pack

In May, HANMI Semiconductor was named one of the “Top 10 Semiconductor Equipment Companies” in the world by TechInsights.  HANMI was founded in 1980 and has grown over the decades to become a world leader in the design, development and manufacture of semiconductor manufacturing equipment. NDC has represented HANMI’s full product line for decades.  Their…
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TTS: Industry Leader in Dry Film Resist Lamination

Teikoku Taping Systems (TTS) was established in 1995 and has grown to build a strong reputation in the semiconductor manufacturing industry.  In April of 2021 they became a subsidiary of Nippon Kayaku expanding their ability to provide total solutions to customers.  Their operational base includes their head office in Japan and two regional headquarters in…
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Sinterstar Mini – An Ideal Solution for R&D & Prototyping

Boschman featured their new Sinterstar Mini a few weeks ago at the Applied Power Electronics Conference 2022 (APEC) in Houston.  The Sinterstar Mini is unique, versatile and ideal for R&D and prototyping.  This sintering solution offers a very compact design, quick and easy changeover and handles a wide variety of products. NDC International represents Boschman…
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Next Generation Vacuum Soldering Systems

Neu Dynamics is proud to represent budatec GmbH – a leading machine manufacturer for the semiconductor and solar industry. Based in Berlin, budatec brings more than 20 years of experience in developing vacuum soldering technologies ranging from small R&D furnaces to fully automated soldering systems. They are recognized as a leader in this segment specializing…
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Wire Bonding: Cost Performance & Flexibility

As representatives of MPP (Micro Point Pro LTD) in the Eastern USA and Canada we are continually impressed with their expertise and dedication to precision, innovation and quality.  For over 40 years MPP has been a leading supplier of wire bonding machinery, tools, consumables and coatings for the semiconductor and microelectronics industries. They offer best…
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MoldMaking Technology Interviews NDC President Kevin Hartsoe

Christina Fuges, Editorial Director, at MoldMaking Technology interviewed Kevin Hartsoe of  Neu Dynamics earlier this month.  Kevin is President at Neu Dynamics and was thrilled to talk with Christina about the company’s success in the electric vehicle market, as well as current challenges. This interview is part of the “MMT Chats” series sponsored by ISCAR…
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Introducing: Sinterstar Mini from Boschman

We are excited to announce the availability of the new Sinterstar Mini!  Boschman Technologies unveiled this system earlier this month at the productronica trade show in Munich. Boschman was founded in 1987 and is a family-owned Dutch company offering advanced packaging solutions and specializing in advanced transfer molding and sintering systems.  NDC International represents Boschman…
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FA Systems Laser Enclosures Exceed Expectations

NDC International has long offered systems from FA Systems Automation (FASA). Based in Singapore and established in 1988, FA Systems Automation serves the global semiconductor industry offering customized manufacturing solutions. Their flexible manufacturing systems are designed to be adaptable to changes in the product giving manufacturers an advantage in a rapidly changing manufacturing environment. FASA’s…
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