NDC International has represented HANMI’s full equipment line for decades! For over 40 Years HANMI Semiconductor has focused on building partnerships and investing in a sustainable future, earning them a leading position in the semiconductor equipment industry for their design, development and manufacturing. HANMI Now World-Leader in Dual-Chuck Saws In June HANMI announced completion of…
It is with deep sadness that the team at Neu Dynamics says goodbye to Dave Campbell, Senior Vice President and co-owner of NDC International since 2003. Dave passed away peacefully on June 16th in Yardley, PA. He was 81 years old. Dave founded and owned ESC (Equipment for Semiconductors) in 1980 and ran that business…
Boschman Package Development is a Dutch company that develops industry-defining packaging solutions for MEMs, sensors, power devices and medical/optical products. They provide a wide range of services and support from concept-design, to transfer, to mass production. NDC International represents Boschman Package Development in the Eastern United States. Boschman – Leader in Silver Sintering Technology Boschman…
MPP (Micro Point Pro LTD) has been a leading supplier of wire bonding machinery for over 40 years! MPP has a long-standing reputation for precision, innovation and quality. They offer wire bonding tools, high-precision expendable tools, probe head solutions, and special coatings for the semiconductor and microelectronic device assembly industry. NDC International proudly represents the…
Kulicke & Soffa (K&S) serves the automotive, consumer, communications, computing and industrial markets as a top provider of semiconductor and electronic assembly solutions. The company was established in 1951 and in 1971 became one of the first technology companies listed on the NASDAQ. NDC International is the North American distributor for K&S brand dicing blades…
We are proud to represent Boschman Package Development. Based in the Netherlands, Boschman has been a leading high-tech player in the semiconductor packaging equipment industry since 1987. Package Development by Boschman offers package technology research, package development, qualification, prototyping as well as small to medium volume manufacturing services. They can manufacture products in quantities of…
If you read our last blog you know that Yole Développement is forecasting significant growth in the bioMEMS market predicting growing from $3.7 billion in 2019 to $6.3 billion by 2025. BioMEMS are sensors and microfluidic devices that are integrated into medical equipment utilizing micro-sensors, transducers, actuators, and electronic components. They are frequently used in…
Yole Développement forecasts significant growth in the bioMEMS market in 2020. This sector which was worth $3.7 billion in 2019 is forecasted to grow 12.4% in 2020 to $4.2 billion. Over the long term, Yole projects a 9.2% compound annual growth rate which has the sector reaching $6.3 billion by 2025. BioMEMS are microelectromechanical systems…
This spring HANMI Semiconductor celebrated its 40th anniversary! The company was founded in 1980 and has grown steadily over the decades to become known as a world-class semiconductor manufacturer. NDC International has been a long-time partner in their Global Network representing their Core Technology including Vision Technology and Laser Technology as well as their full…
We are proud to represent Boschman – the only semiconductor equipment company that has the skill and knowledge to offer Package Development among their services. Based in the Netherlands, Boschman has been a high-end niche player in the semiconductor packaging equipment industry since 1987. What Makes Boschman Package Development Unique? Boschman partners closely with their…
