New Test Handlers from FA Systems

We are pleased to announce that FA Systems Automation (FASA) has expanded their test handler line! Known for their reliability and performance, the FASA test handlers now include 2 new models for a total of 8 systems to meet your needs. NDC International is proud to represent FASA – a company that has been empowering…
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Sinterstar Mini – Fast, Flexible & Practical

Our partner Boschman has long led the way in sintering technology and continues to be a supplier of top choice whether you engage in small batch or large-scale production. We are pleased to feature the new launch of their innovative Sinterstar Mini.  This system is unique, versatile and ideal for R&D and prototyping. It offers…
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NDC – More than Meets the Eye!

As one of our current customers or contacts you may know us for molds and molding presses, but did you know we also specialize die attach systems?  In fact, we provide the full range of solutions you need for backend semiconductor processing and electronics encapsulation.  Over the last 20 years, we have become one of…
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Leading Ag-Sintering Technologies from Boschman

Boschman has been leading the way in sintering technologies since 2014 when they introduced the groundbreaking Sinterstar Innovate-F-XL. The company, based in the Netherlands, specializes in advanced transfer molding and sintering systems. NDC International represents Boschman Advanced Packaging Technologies in the Eastern United States. Ag-Sintering Improves Performance & Longevity New technologies have been developed to…
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Maximize Your Productivity with the HANMI Wafer micro SAW

HANMI’s innovative micro SAW line was launched in 2021 and now offers 8 models! For our customers specializing in wafer dicing and package/panel cutting, the HANMI wafer micro saw is of particular interest because of its incredible accuracy and ease of use.  This full-automation micro SAW for wafer cutting is a standalone 12-inch model that…
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HANMI’s TC Bonder Line Continues Expansion

HANMI is always at the leading edge of innovation.  That’s why we were not surprised that they were among the first companies to develop a TC bonder (thermal compression bonder).  These machines, which bond individual chips on processed wafers, are in increasing demand driven by the introduction of high-bandwidth memory (HBM) and DDR5. DUAL TC…
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HANMI’s Package Singulation Saw – The micro SAW P2101

HANMI’s Rapid Development of the micro SAW Line Founded in Korea in 1980, HANMI Semiconductor has grown to become a top developer and manufacturer of semiconductor manufacturing equipment.  They enjoy the highest reputation grounded in their focus on quality improvement, efficiency, R&D, innovative technologies and service. NDC has been representing HANMI for decades!  It has…
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Superior Test Handlers from FA Systems

FA Systems Test Handlers Deliver Reliability & Performance NDC International is proud to represent FA Systems Automation (FASA).  For 35 years FASA has been empowering innovation through manufacturing excellence.  FASA specializes in flexible systems that are designed to adapt – giving manufacturers an advantage in a rapidly evolving manufacturing environment. Their mission is to deliver…
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MAT 6200 Die Attach System– Simple is Better

See the MAT 6200 Die Attach System at iMAPS – Booth #402! MAT has 35 years of experience… and it shows!  In systems that are simple and better.  NDC is proud to represent MicroAssembly Technologies, Ltd. (MAT) in the USA, Canada and Mexico. MAT specializes in complex, high-value applications for microelectronics assembly. Their focus is…
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Budatec’s Innovative Vacuum Soldering Systems

Budatec GmbH has over 30 years of experience in vacuum soldering technology. Based in Berlin, they offer vacuum soldering and sintering systems ranging from small R&D to fully automated systems. They have a global distribution network focusing on North America, Europe and Japan. With the advent of power electronics, laser and CPV applications, a new…
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