Solder Ball Placement systems

KOSES Flux Pre-Cleaning System KPM300

FEATURES

  • Dual Rail Flux Pre-Cleaning System
  • Multiple Function System for Cleaning: OSP Pre-Cleaning & Via Cleaning 
  • High Productivity 
  • Reliability & Quality
  • Flux Dotting for OSP Removal on Bottom Ball Pad
  • Provides Optimized Blade Angle
  • Parameter Setting for Station Block Height Control Prevents Material Damage 
  • Strip Warpage Compensation 
  • Reliable Flux Auto Supply & Management
KOSES KAM7000F Solder Ball Attach System

FEATURES

  • New Solder Ball Mounting System for Singulated Packages Handles Wide Boat Flux Dotting & Ball Attach in 1 Shot
  • B.P.M. for Wide Boat is Approximately 2 Boat
  • Cycle Time for 1 Boat Under 29 Sec.
  • Mechanical Clamp Increases the Applicable Package Quantities in a Boat
    • Package Alignment Using Mechanical Alignment Classified by Normal Package & Heat Spread Type
    • Normal Package Uses Bottom Guide Concept to Achieve Accurate Alignment
  • Heat Spread Uses Top Guide Concept to Achieve Accurate Alignment
  • Applicable Min Ball Diameter: 0.2mm, Min Pitch: 0.4mm
    • Diameter of 0.2 Ball Can Use 2-Step or 3-Step
  • Vision Inspection is Optional for the Offloader (Model: KUM4000F)
KOSES KWA 970 Wafer Solder Ball Attach System

FEATURES

  • Interchangeable Loader/Off Loader According to User Selection
    • 6 ~ 8-inch Wafer Application
    • Easy-Access Design
  • Robot System Handles Wafers at 8 Points in 340 Degrees
    • Soft & Precise Movement Prevents Wafer Damage
    • Optional Pre-Alignment System
    • Transfer Arm with Sensor to Identify the Wafer
  • X, Y, θ Table Controlled by PRS Vision System
  • PRS Vision System Checks Wafer Surface to Provide Wafer Aligning Data
  • Flux Mask Printing System Ensures the Exact Flux Volume and Flux Position
  • Individual Vacuum Control System Allows Ball Placement on the Wafer Edge Corner
  • Pre-Vision and Post Vision to Verify Accuracy