Check out APEC Booth #2051!
IEEE Applied Power Electronics Conference and Exposition (APEC) will take place in San Antonio, Texas from March 23-25th. Neu Dynamics will be on hand to stay on top of the latest in power electronics industry research and advancements.
Come meet us in the Boschman Booth #2051. Talk to the experts and get an update on the latest trends in power module assembly technologies. Boschman offers advanced packaging solutions and specializes in advanced transfer molding and sintering systems. Neu Dynamics represents Boschman Package Development in the Eastern United States.
PLUS: Powertrim will be present as well. The Powertrim Flex Line is an integrated trim and form manufacturing solution for power modules and related processes. Neu Dynamics is pleased to represent Powertrim in North America.