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HANMI Molding Presses

Home Products Molding Presses HANMI Molding Presses
hanmi_mechanical_molding_press

Mechanical Molding Press: Model HP-120

FEATURES

  • Mechanical Transfer Plunger
  • Clean Room Compatible Mechanical Press
  • Automatic Mold Cleaning System
  • Soft Close and Close Loop Functions
  • Compact Machine Footprint
  • Multiple Temperature Controls: +/-2 oC
  • Easy to Use Graphic Interface with Touch Screen LCD Monitor
PDF Spec Sheet
NDCI Hanmi Compression Automold S1000

Auto Molding System: Compression Auto Mold S-1000

FEATURES

Various Press Clamping Tonnage Up to 175 Tons

Independent Molding with Modular Concept (up to 4 modules)

Field Proven, Excellent Molding Quality

  • Void free and minimum wire sweep
  • Improved molding quality (no pre-heating required)

Top Pin Gate Molding Capable

  • No runner and no gate remain
  • Solutions for molding thin package, non-metal substrate and high pin count packages
  • Suitable for PoP (Package on Package) and smartcard
PDF Spec Sheet
hanmi_hydraulic_molding_press

Hydraulic Molding Press (Top/Bottom Transfer): Model HMP – 260TB

FEATURES

Clamping Tonnage Available Up to 300 Tons

Patented Top/Bottom Transfer

  • Selectable top or bottom plunger allows you to easily switch over to top or bottom transfer mode without additional conversion
  • Provides machine flexibility for both conventional top transfer or MPG molding (no additional hydraulic line required)

Soft Close Function

  • Four-point soft close to detect lead frame overlapping and foreign materials (mold protection)

Close Loop Function to Minimize Void and Wire Sweep

  • Digitalized transfer cylinder velocity and pressure control (velocity and pressure compensation function)

Individual Sub-Cylinder Pressure Control

  • Improves mold flash issue

Solution for Oil Leakage and Easy Maintenance

Multiple Temperature Controls

  • 32 heaters and thermocouples for even temperature control
  • Computer controlled

Computer Controlled Press Operation and Real Time Monitoring

  • Controls and monitors all press functions
  • Can store up to 100 sets of parameters including mold heat, clamping pressure, transfer profiles, etc.
  • Real-time graphic display on LCD monitor

Light Screen Safety Systems

Improved Accessibility

Simplified Hydraulics for Ease of Maintenance

World-Class Quality and Workmanship

  • Rugged construction and rigid QC standards assure trouble-free operation
PDF Spec Sheet
hanmi_LEDpackaging_systems.

LED Packaging Systems

FEATURES

Manual Mold Press

  • Capable of handling various LED packages
  • Field proven, excellent molding quality

Hydraulic Mold Press

  • Patented top and bottom transfer mechanism
  • Clamping tonnage up to 300 tons
  • Soft-close function and close-loop function

Mechanical Mold Press

  • Mechanical transfer plunger (oil-less system)
  • Clamping tonnage up to 120 tons
  • Compact machine footprint and user-friendly interface

About Us

 

NDC International has served companies like you - in the business of manufacturing electronic equipment - since 2003. We are distributors of manufacturing equipment for semiconductor packaging, handling and assembly. We offer you manufacturing machinery and equipment from leading companies around the globe including HANMI and FA Systems.

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Contact Information

110 Steamwhistle Drive, Ivyland PA 18974, USA

(800) 910-8150 or (215) 355-2460

sales@neudynamics.com

(215) 355-7365

Mon - Fri: 9:00 - 6:00 EST

Copyright 2017 NDC International.