Neu Dynamics will be at the International Microelectronics Assembly and Packaging Society (iMAPS) Conference 2026 in Phoenix, Arizona. We would love to meet you there!

We will be in the exhibition hall March 3rd and 4th. Stop by Booth #613 to say hello and learn more about our machining services, molds and tooling, molding services, assembly equipment, equipment service, and consumables.

Reach out to Nick Leonardi at 480-334-7455 to set up a time to discuss how Neu Dynamics can support your device packaging processes.