We are excited to connect with you at the IMAPS conference in Phoenix, Arizona! Visit the Neu Dynamics team at Booth #613. Looking forward to meeting you there!

The Leading Conference for Device Packaging

The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025. This international event, organized by the International Microelectronics Assembly and Packaging Society, is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields.

More information here.