Are you attending iMAPS Boston this week? If so, be sure to visit our Booth #316
The Neu Dynamics team will be exhibiting at the show on September 29th & 30th. Staff from Micro Point Pro (MPP), MicroAssembly Technologies (MAT), Boschman Advanced Packaging Technology, Sikama International and budatec GMBH will be at our booth. Plus, our friends from Batten & Allen will be there too – exhibiting in Booth #516. Stop by to meet us!
Expert Alexander Leob Demonstrates the Newly Launched iBOND5000Plus
Alexander Leob, Chief Technology Officer at Micro Point Pro, will be on hand to demonstrate the new iBOND5000Plus wire bonder! MPP’s proven 4500 and 5000 Series were market leaders for nearly a decade. This new system builds on the success of these platforms and delivers unparalleled precision, innovation, and quality.
This advanced series is designed for demanding applications, including optoelectronic modules, hybrids/MCMs, microwave products, discrete devices/lasers, chip-on-board, and sensors. Available in Wedge, Ball, and Dual Bonder configurations, it provides a versatile and highly capable bonding solution.
Key benefits include:
- Real-Time Control: Equipped with 6 rotary dials for the real-time adjustment of critical parameters.
- Enhanced Ergonomics: Features a microscope slide with extended reach for improved operational visibility.
- Built-In Quality Assurance: Includes a secondary inspection station dedicated to device post bond visual inspection.
- Streamlined Setup: Designed with easy access for wire insertion, simplifying the workflow.
- Intuitive Interface: Physical units are shown for the bonding parameters displayed on the screen.
This new system offers improved usability, flexibility and efficiency in daily production. Set up an appointment with us at the show to explore how the iBOND5000Plus can bring flexibility and efficiency to your wire bonding applications. Call (215) 355-2460 or email Sales@NeuDynamics.com.
See the MAT Model 6200 Automatic Die Attach System in Action
Our partners from MicroAssembly Technologies will be in our booth to demonstrate the Model 6200 Automatic Die Attach System – “The Crossover.” MAT is at the top of their game offering machines with unmatched versatility and lowest cost of ownership.
This automatic die attach system utilizes a small and unique table-top configuration. It offers unrivaled versatility – allowing you to perform the widest range of cold and heated die attach processes on the same machine. Process capabilities include Epoxy Die Attach, different Eutectic processes, GGI based on Ultrasonic or Thermo-compression processes, ACF/ACP, Ag Sintering, Die Stacking and many other processes.
- Fully-automatic and semi-automatic process allowing greatest flexibility and easy of operation.
- Handles active and passive components presented in 2″ and/or 4″ waffle/gel packs, different size tape and reel feeders and custom trays.
- Very high-accuracy servo systems control the main machine axes.
- High-resolution digital vision and advanced image processing system.
- Time-pressure, volumetric or jet dispenser for applying thermal or UV curing adhesives.
- Double dispenser for two different adhesives.
MAT’s die attach systems deliver next level value and flexibility. Stop by our booth for more details and learn how to put their systems to work for you.