K&S Capillaries: Enhanced Bonding Quality

NDC International is the North American distributor for the Kulicke & Soffa (K&S) dicing blades and capillaries. K&S Capillary Consumables has over 40 years of experience and is a leader in the semiconductors assembly industry – developing and manufacturing advanced bonding tools ​for a wide array of applications. Their latest capillary products offer enhanced bonding quality and best cost-of-ownership.

Quantis™ QFN:  Cutting Edge Solutions for Copper Wire Bonding

Based on the most advanced ceramics composite platform, Quantis™ QFN is a copper wire bonding capillary product that capitalizes on K&S’ extensive copper wire applications experience.  Incorporating innovatively engineered geometrical designs, the Quantis™ QFN is designed to handle the most difficult process challenges on a range of QFN carriers.

Features:

  • New RP1™ material – highest micro-structure quality and improved resistance to failure
  • Superior mechanical properties – improves consistency of performance

Benefits:

  • Improved process stability and portability
  • Larger bonding parametric (process) window
  • Higher response consistency between capillaries
  • Competitive cost-of-ownership
  • Slower tip wear rate with enhanced design and material mechanical properties
  • Enhanced workability which translates into higher productivity
  • More bonds per capillary and per hour

Application Range:

  • Copper wire diameter range: 0.7 – 2.5 [mil]
  • Copper wire type: Any
  • Package carrier families: Mid pin-count QFN’s & QFP’s (and their various sub-types)
TeraCap™:  Capillaries for Advanced Memory & Logic Devices

TeraCap™ is the latest capillary series for advanced memory and logic devices packaging using either gold or silver wire.

Features:

  • ​​New iZX high quality composite ceramics
  • Tighter control over critical dimensions -0/+1 [μm]
  • Designed specifically for various memory devices structures (stacked, deep access, overhang) and bonding modes

Benefits:

  • Excellent bonding and looping consistency (yield)
  • Superior workability (MTBA – more bonds per hour)
  • Extended durability (more bonds per capillary)

Application Range:

  • Bond pad pitch [μm]: 40 – 120
  • Wire diameter [μm]: 15 – 33
  • Wire type: any gold and silver alloy wire
  • Device types: any memory and logic devices

For more detailed information on these capillaries download this presentationK&S Capillaries – Enhancing Bonding Quality with Best Cost-of-Ownership.  

Contact Cheryl Martin at (267) 999-1266 for more information!
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