MAT Die Attach – Next Level Value & Flexibility
NDC represents MicroAssembly Technologies, Ltd. (MAT) in the USA, Canada and Mexico. MAT provides proven, simple solutions for your complex…
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HANMI Wafer micro SAW: Maximized Productivity & Precision Accuracy
NDC is proud to represent HANMI Semiconductor – one of the top semiconductor equipment companies in the world. We have…
Packaging & Assembly Trends for Next Generation Power Modules
Our friends at Boschman shared their insights and perspectives on trends in Power Modules as we enter 2023: The global…
Vacuum Soldering Systems from budatec
Budatec GmbH offers a complete line of vacuum soldering systems to meet your needs from small to large batch machines,…
MAT Die Attach Machines Deliver Ultimate Flexibility & Value
NDC International, Inc. is now representing MicroAssembly Technologies, Ltd. (MAT) in the USA, Canada and Mexico. MAT specializes in innovating…
NDC International Now North American Distributor for MicroAssembly Technologies
IVYLAND, Pennsylvania–Oct. 31, 2022—NDC International, Inc., a leading supplier of tooling for the semiconductor, automotive, medical and electronics industries, today…
HANMI EMI Shielding Line Offers Increased Productivity & Performance
HANMI Semiconductor was established in Korea in 1980 and has grown to become a top developer and manufacturer of semiconductor…
Featuring HANMI’s New Wafer micro SAW & Deals on MPP Bonders!
We are looking forward to connecting with you at iMAPS next week from October 3rd through 6th. Stop by to…
Vacuum Soldering Systems that Increase Your Yield
If you are attending iMAPS in Boston this October, you will want to check out budatec’s line of vacuum soldering…
TFA Flex Line: Trim & Form System for Power Modules
We are pleased to inform you that NDC is now representing Trim Form Automation (TFA) Europe! TFA Europe is focused…
HANMI micro SAW Leads the Pack
In May, HANMI Semiconductor was named one of the “Top 10 Semiconductor Equipment Companies” in the world by TechInsights. HANMI…
TTS: Industry Leader in Dry Film Resist Lamination
Teikoku Taping Systems (TTS) was established in 1995 and has grown to build a strong reputation in the semiconductor manufacturing…