Blog

HANMI micro SAW Leads the Pack

In May, HANMI Semiconductor was named one of the “Top 10 Semiconductor Equipment Companies” in the world by TechInsights. HANMI…

Teikoku Taping Systems (TTS) was established in 1995 and has grown to build a strong reputation in the semiconductor manufacturing…

Boschman featured their new Sinterstar Mini a few weeks ago at the Applied Power Electronics Conference 2022 (APEC) in Houston. …

Neu Dynamics is proud to represent budatec GmbH – a leading machine manufacturer for the semiconductor and solar industry. Based…

As representatives of MPP (Micro Point Pro LTD) in the Eastern USA and Canada we are continually impressed with their…

Christina Fuges, Editorial Director, at MoldMaking Technology interviewed Kevin Hartsoe of Neu Dynamics earlier this month. Kevin is President at…

We are excited to announce the availability of the new Sinterstar Mini! Boschman Technologies unveiled this system earlier this month…

NDC International has long offered systems from FA Systems Automation (FASA). Based in Singapore and established in 1988, FA Systems…

Neu Dynamics and NDC International were recently featured in an article in MoldMaking Technology by Christina Fuges entitled, “Thermoset Mold…

NDC International is proud to announce our relationship with Teikoku Taping System Co., Ltd (TTS). The company was founded in…

NDC International has represented HANMI’s full equipment line for decades! For over 40 Years HANMI Semiconductor has focused on building…

It is with deep sadness that the team at Neu Dynamics says goodbye to Dave Campbell, Senior Vice President and…