Boschman Expands Ag-Sinter Market Share
Boschman Technologies – recently re-branded as Boschman Advanced Packaging Technologies – just announced a milestone in the ag-sinter market for…
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Great Deals on the MPP iBond 5000!
If you are in the market for an advanced ball/wedge bonder, then we’ve got good news for you! We are…
APC Develops SiC Power Module for Tesla Model 3
NDC International represents APC (Advanced Packing Center) in the Eastern United States. APC is a Dutch company founded by Boschman…
Now Representing budatec Vacuum Soldering Systems!
NDC International is proud to announce that we are now representing budatec GmbH in North America. Budatec develops equipment for…
Join Us at EPS Sept 18th & 19th!
The 30th annual Electronics Packaging Symposium (EPS) will take place in Binghamton, NY on September 18th and 19th. Neu Dynamics/NDC…
Haecker Automation’s OurPlant Pocket
Since the Fall of 2017 NDC International has been representing Haecker Automation in North American. Haecker is a family-owned company…
Discover Silver Sintering at SEMICON West!
Silver Sintering is an exciting new technology that has captured the interest of our customers this year. We are now…
See You at ECTC 2018!
Stop by and see us at the Electronic Components and Technology Conference (ECTC) to be held May 29 through June…
Neu Dynamics at iMaps New England – Booth #104
The iMAPS New England 45th Symposium & Expo will be held on May 1, 2018 in Boxborough, Massachusetts. The theme…
NDCI Now Representing Master Machinery Corp.
NDC International is pleased to announce that we are now representing Master Machinery Corporation (MMC). As a leading manufacturer and…
NTAP Helps You Invest in Your Workforce
Apprenticeships Are Good for Businesses … and Workers Here at Neu Dynamics we believe in investing in our workforce in…
Silver Sintering for Electronic & Semiconductor Applications
Reliability of Ag-Sintering Bonding Technology Through a relationship announced a few months ago, NDC International is now representing Boschman Technologies…