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Boschman Technologies – Enabling Revolutionary Solutions

Neu Dynamics represents Boschman Advanced Packaging Technology in the Eastern United States. Boschman has been at the forefront of sintering…

MicroAssembly Technologies, Ltd. (MAT) was founded in 2000. With 35 years of experience, the folks at MAT deliver simple, flexible,…

In September, HANMI Semiconductor announced the launch of the 7th generation new micro SAW P2101 & VISION PLACEMENT 6.0 GRIFFIN.…

At the iMAPS show in Boston earlier this month, we had huge interest in budatec’s systems from power module manufacturers.…

Philadelphia, PA, October 25, 2024 – Neu Dynamics Corporation and NDC International (collectively “Neu Dynamics”) are pleased to announce their…

Philadelphia, PA, September 23, 2024 – Neu Dynamics Corp. (NDC) is pleased to announce the appointment of Nicholas Leonardi to…

Are you attending The Battery Show North America in October? If so, we invite you to stop by Booth #2550…

Leading the Way in Trim & Form Systems for Power Modules In June of 2024, Trim Form Automation (TFA) Europe…

If you are in the market for a vacuum soldering system, don’t miss the opportunity to meet budatec at the…

NDC International is pleased to announce that we are partnering with ESTEK Group to distribute their CMOS Imaging Sensor Inspection…

We are pleased to announce that FA Systems Automation (FASA) has expanded their test handler line! Known for their reliability…

Our partner Boschman has long led the way in sintering technology and continues to be a supplier of top choice…