UNISTAR Auto-2-FF-L

  • Fully automatic 2-strip Film Assisted Molding system
  • Designed for advanced mems, sensor, power, qfn and bga packages
  • System works with lead frames, substrates and ceramic carriers as well as individual modules
  • Standard equipped with Boschman’s unique and patented double Film Assisted Molding technologies
  • Clamping Mechanism: A highly-accurate continuously-variable, automatic clamping force mechanism from 20 to 100 tons per chase is used to enable control of mold clamping and film compression
  • Transfer and Cure Process Control: Servo controlled for maximum accuracy and a long service life
  • Data collection and process monitoring

UNISTAR Auto-4-FF-XL

  • Fully automatic 4-strip Film Assisted Molding system
  • Designed for advanced mems, sensor, power, qfn and bga packages
  • System works with lead frames, substrates and ceramic carriers as well as individual modules up to a size of 100 x 300 mm
  • Standard equipped with Boschman’s unique and patented double Film Assisted Molding technologies
  • Clamping Mechanism: A highly-accurate continuously-variable, automatic clamping force mechanism from 20 to 100 tons per chase is used to enable control of mold clamping and film compression
  • Transfer and Cure Process Control: Servo controlled for maximum accuracy and a long service life
  • Data collection and process monitoring

UNISTAR Innovate-2-FF-L

  • The most universal semi-automatic molding system designed for practically any kind of package
  • Works with lead frames, substrates, ceramic carriers and individual modules
  • Can handle standard mini-pellets, powder and liquid encapsulation materials
  • Comes standard with most Boschman unique and extensive Film Assisted Molding technologies
  • Suitable for package technology research, package development, process optimization, qualification runs and small to medium size production volumes
  • This system can handle test molds, 1-strip molds and 2-strip molds
  • High-precision press with self-correcting clamping system
  • Unique automatic substrate thickness compensation clamping system
  • Advanced transfer and cure process closed loop control
  • All Film Assisted Molding technologies can be processed with short conversion times
  • Patented Dynamic Insert Control Technology optional
  • Energy-efficient system design, small footprint and easy access

UNISTAR Innovate-2-NF-L

  • The most universal semi-automatic molding system designed for conventional packages
  • Suitable for small to medium sized production volumes
  • Noted for very short conversion times when moving from one package to another and low-cost tooling
  • This system can handle test molds, 1-strip molds and 2-strip molds
  • Ideal for package technology research, package development, process optimization and qualification runs
  • Lead frames, substrates ceramic carriers, as well as individual modules can be processed
  • Ergonomic design makes the system easy to operate
  • CE-compliant
  • High-precision press with self-correcting clamping system
  • Unique automatic substrate thickness compensation clamping system
  • Advanced transfer and cure process closed loop control
  • Energy-efficient system design, small footprint and easy access
  • Vacuum mold option available
  • Unique Automatic Substrate Thickness Compensation Clamping System optional

Reelstar Auto-1-NF-S & Auto-2-NF-S

  • Automatic (single reel or dual reel) reel-to-reel multi-plunger molding system
  • Designed for contactless and contact smartcard modules, discrete small signal, power packages and ultra-thin tape-based packages
  • Offers high throughput, competitive pricing, low compound usage and high-precision mold tooling
  • Offers a mold length of 350 mm and very short machine time to achieve maximum productivity
  • Very precise pitch control for maximum accuracy in package offset and cavity depth precision
  • Ultra-thin endless strip handling < 60 Micron
  • Separate de-gate station
  • High-precision press with self-correcting clamping system
  • Advanced transfer and cure process closed loop control
  • Easy and fast conversion between different packages
  • Three mold cleaning methods
  • CE Certified
Menu