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HANMI Semiconductor Die Attach / Sort Systems

Home Products Pick and Place HANMI Semiconductor Die Attach / Sort Systems

We offer the following die attach / die sort systems from HANMI Semiconductor:

hanmi_flipchip_A110

Hanmi Die Sorter

FEATURES

High Productivity: Typically 10,000 UPH\

Pick & Place Head with Theta-Compensation

Wafer Cassette Handler

  • Wafer Handling:
  • Programmable wafer stretch
  • Die ejection
    • Servo controlled Z (synchronous with pick head)
    • Ejector correction of +/- 5mm for fine correction

Automatic Die Pick-Up & Mounting Height Verification & Compensation

  • Voice coil motor for Z

Pick & Place Force Programmable Via Voice Coil Motor

Waffle Pak/GEL Pak Handling System (2-4″, or custom spec.)

  • Stack at input
  • Stack at output

Advanced Vision Inspection with High-Resolution Cameras

  • Vision engine – HANMI vision system
    • All parameters can be saved
  • Camera resolution: 640 x 480
  • Lens zoom: x0.4 ~ 0.6 (manual zoom)
  • FOV: 3 ~ 12mm
  • Illumination: Coaxial (RGB) + Size (RGB)
    • Light controller adjustable via screen

Quick & Easy Conversion (10 min. maximum)

Low Cost of Ownership

PDF Spec Sheet
hanmi_diesorter

Hanmi LED Die Attach

FEATURES

High Productivity: 21,000 UPH (dry running speed only)

  • Dual epoxy writing head
  • Single die bonding head

Die Bonding Head with Theta-Compensation

Automatic Die Pick-Up & Mounting Height Checking with Compensation

Modular Concept for Inline Bonding

Advanced Vision Inspection with High-Resolution Cameras

Low Cost of Ownership

Quick & Easy Conversion

PDF Spec Sheet
Hanmi Flip Chip Model FC Bonder - A110

Hanmi Flip Chip: Model FC Bonder – A110

FEATURES

Productivity: 10,000 UPH (dry running), 5,000 (real production)

High Accuracy: ± 7.0 microns @ 3σ (normal), ± 10.0 microns @ 3σ (pre-aligned)

Programmable Bonding Force: 1N ~ 25N

Die Size: 0.5 mm ~ 30.0 mm

Wafer Size: Up to 12″

The Most Advanced X-Y-Z Motion Controlled Bonding Head

Dual Flipper & Bond Head for High Mass Production

Precise Pick Up & Bonding Process Utilizing Vision Inspection

Improved Machine Productivity

SMEMA In-Line Capability

PDF Spec Sheet
Hanmi Flip Chip Model FC Bonder - A110

Hanmi Flip Chip: Model FC Bonder – A110 Ultra

FEATURES

Productivity: 15,000 UPH (dry running), 5,000 (real production)

High Accuracy: ± 5.0 microns @ 3σ (normal), ± 10.0 microns @ 3σ (pre-aligned)

Programmable Bonding Force: 1N ~ 25N

Die Size: 0.5 mm ~ 30.0 mm

Wafer Size: Up to 12″

The Most Advanced X-Y-Z Motion Controlled Bonding Head

Dual Flipper & Bond Head for High Mass Production

Precise Pick Up & Bonding Process Utilizing Vision Inspection

Improved Machine Productivity

SMEMA In-Line Capability

Mass Defect Protection Capability

PDF Spec Sheet
NDCI Hanmi Flip Chip Bonder S100

Hanmi Flip Chip: Model FC Bonder – S100

FEATURES

High Productivity

  • 15,000 UPH (Based on Dry Run)

Precision Bonding Capability

High Reliability

Precision Bonding Capability

High Reliability

  • One Casting Body Structure

Low Cost of Ownership

  • Economic Version of Flip Chip Bonder
PDF Spec Sheet

About Us

 

NDC International has served companies like you - in the business of manufacturing electronic equipment - since 2003. We are distributors of manufacturing equipment for semiconductor packaging, handling and assembly. We offer you manufacturing machinery and equipment from leading companies around the globe including HANMI and FA Systems.

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Contact Information

110 Steamwhistle Drive, Ivyland PA 18974, USA

(800) 910-8150 or (215) 355-2460

sales@neudynamics.com

(215) 355-7365

Mon - Fri: 9:00 - 6:00 EST

Copyright 2017 NDC International.