We offer the following die attach / die sort systems from HANMI Semiconductor:
Hanmi Die Sorter
FEATURES
High Productivity: Typically 10,000 UPH\
Pick & Place Head with Theta-Compensation
Wafer Cassette Handler
- Wafer Handling:
- Programmable wafer stretch
- Die ejection
- Servo controlled Z (synchronous with pick head)
- Ejector correction of +/- 5mm for fine correction
Automatic Die Pick-Up & Mounting Height Verification & Compensation
- Voice coil motor for Z
Pick & Place Force Programmable Via Voice Coil Motor
Waffle Pak/GEL Pak Handling System (2-4″, or custom spec.)
- Stack at input
- Stack at output
Advanced Vision Inspection with High-Resolution Cameras
- Vision engine – HANMI vision system
- All parameters can be saved
- Camera resolution: 640 x 480
- Lens zoom: x0.4 ~ 0.6 (manual zoom)
- FOV: 3 ~ 12mm
- Illumination: Coaxial (RGB) + Size (RGB)
- Light controller adjustable via screen
Quick & Easy Conversion (10 min. maximum)
Low Cost of Ownership
Hanmi LED Die Attach
FEATURES
High Productivity: 21,000 UPH (dry running speed only)
- Dual epoxy writing head
- Single die bonding head
Die Bonding Head with Theta-Compensation
Automatic Die Pick-Up & Mounting Height Checking with Compensation
Modular Concept for Inline Bonding
Advanced Vision Inspection with High-Resolution Cameras
Low Cost of Ownership
Quick & Easy Conversion
Hanmi Flip Chip: Model FC Bonder – A110
FEATURES
Productivity: 10,000 UPH (dry running), 5,000 (real production)
High Accuracy: ± 7.0 microns @ 3σ (normal), ± 10.0 microns @ 3σ (pre-aligned)
Programmable Bonding Force: 1N ~ 25N
Die Size: 0.5 mm ~ 30.0 mm
Wafer Size: Up to 12″
The Most Advanced X-Y-Z Motion Controlled Bonding Head
Dual Flipper & Bond Head for High Mass Production
Precise Pick Up & Bonding Process Utilizing Vision Inspection
Improved Machine Productivity
SMEMA In-Line Capability
Hanmi Flip Chip: Model FC Bonder – A110 Ultra
FEATURES
Productivity: 15,000 UPH (dry running), 5,000 (real production)
High Accuracy: ± 5.0 microns @ 3σ (normal), ± 10.0 microns @ 3σ (pre-aligned)
Programmable Bonding Force: 1N ~ 25N
Die Size: 0.5 mm ~ 30.0 mm
Wafer Size: Up to 12″
The Most Advanced X-Y-Z Motion Controlled Bonding Head
Dual Flipper & Bond Head for High Mass Production
Precise Pick Up & Bonding Process Utilizing Vision Inspection
Improved Machine Productivity
SMEMA In-Line Capability
Mass Defect Protection Capability
Hanmi Flip Chip: Model FC Bonder – S100
FEATURES
High Productivity
- 15,000 UPH (Based on Dry Run)
Precision Bonding Capability
High Reliability
Precision Bonding Capability
High Reliability
- One Casting Body Structure
Low Cost of Ownership
- Economic Version of Flip Chip Bonder
