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MicroAssembly Technologies, Ltd. (MAT) specializes in innovating and manufacturing die attach machines for microelectronics assembly. Their specific strengths are with complex, high-value applications. The company was founded in 2000 and is located in Israel.  

Their systems are a great fit for high-mix low-volume applications.  NDC International offers MAT’s two current systems:  

MODEL 6500: Automatic, High Accuracy Die Attach System

FEATURES:

  • Performs Advanced & Complex Die Attach Processes with Very High Placement Accuracy
  • Very Large Work Area
  • Unmatched Versatility
  • Performs Room Temperature & Heated Processes Including:  Epoxy, Eutectic, Thermo-Sonic, Thermo-Compression, ACF/ACP, NCF/NCP, Flip Chip, DAF, Ag Sintering & More
  • Handles Active & Passive Components Between 0.15 mm up to over 50 mm
  • Specializing in Complex Applications:  Combined Processes, Unusual Die Sizes & Aspect Ratios, Very Large Number of Components, etc.
  • User-Friendly Graphic Interface Enables Switching Processes in Seconds
  • Plug & Play Hardware
  • Fully Automatic with Optional Manual Load/Unload for Easy Operation
PDF Spec Sheet

MODEL 6200: Automatic Die Attach System, The Crossover

FEATURES:

  • Small & Unique Table-Top Configuration
  • Offers Best Price/Performance 
  • “Crossover” System with Unmatched Versatility & Very High Placement Accuracy
  • Performs a Very Wide Range of Cold & Heated Processes on the Same Machine
  • Optimally Handles High-Mix Applications with Minimal Change-Over Time
  • User-Friendly Graphic Interface Enables Switching Processes in Seconds
  • Plug & Play Hardware
  • Fully-Automatic & Semi-Automatic Process Allowing Ultimate Flexibility & Ease of Operation
PDF Spec Sheet
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