NDC International represents the MPP (Micro Point Pro LTD) line of manual wire bonders in the USA, Mexico and Canada.

The long time leader in wire bonding technology, K&S recently sold the Manual Wire Bond business unit to MPP.  The newest line is the iBond5000 Series and is based on the 4500 Series which was a market leader for over a decade.

We offer the following manual wire bonders from MPP:

ibond_5000_Ball (1)

MPP Ball Bonder: Model iBond 5000 Ball

FEATURES

Provides the High Yields and Excellent Repeatability Needed for All Gold Ball Bonding Applications Including:

  • Optoelectronic modules
  • Hybrid/MCMs
  • Microwave products
  • Discrete devices/lasers

Semi-Automatic/Manual Mode with ‘Z’ Option

‘Z’ Axis DC Servo Motion with Closed-Loop Control

Consistent Ball Size Via Negative Electronic Flame-Off

Missing Ball Detection & Auto-Stop

Deep Access Capability

Built-In Temperature Controller

Various Microscope and Spotlight Targeting Options Available

Large 6” x 6” Bonding Area

Variety of Wire Types: Gold & Copper (with copper kit option)

Chessman/Mouse & Manual ‘Z’ Convertible Right or Left

Ball Bonding, Bumping, Coining, Security Bond & Tab

ibond_5000_Ball (1)

MPP Wedge Bonder: Model iBond 5000 Wedge

FEATURES

Provides the High Yield and Excellent Repeatability Needed for Every Wedge Bonding Application Including:

  • Optoelectronic Modules
  • Hybrid/MCMs
  • Microwave Products
  • Discrete Devices/Lasers
  • Chip-on-Boards
  • Leads
  • Sensors
  • High Power Devices

Built-In Temperature Controller

Semi-Automatic/Manual Mode with ‘Z’ Option

Designed for Aluminum Wire, Gold Wire, Ribbon & Copper

Large 5.3” x 5.3” Bonding Area

Deep Access Capability (optional)

‘Z’ Axis DC Servo Motion with Closed-Loop Control

Wide Range of Microscopes and Optical Accessories Available

RoHS Compliant

Chessman/Mouse & Manual ‘Z’ Convertible Right or Left

Bonding Types: Wedge, Tab, Stitch & Ribbon

ibond_5000_Ball (1)

MPP Dual Wedge and Ball Bonder: Model iBond 5000 Dual

FEATURES

One Machine, Dual Function Capabilities

Provides the High Yield and Excellent Repeatability Needed for Every

Wedge Bonding Application

Wedge-Wedge and Ball-Wedge Bonding on the Same Machine

Semi-Automatic/Manual Mode with ‘Z’ Option

Fast Changeover by Operator with No Tools

Special K&S Proprietary Transducer for Proper Bond Tool Mounting

Ball Bonding Capillary Mounts with Split Clamp

90-Degree Deep Access Wedge Bonding with 12.5 mm ‘Z’ Axis Travel

Ball Bonding with 12.5 mm ‘Z’ Axis Travel

  • Special K&S proprietary swing arm EFO/Drag arm assembly

High-End Negative EFO with Missing Ball Detection

High-Q 60kHz Ultrasonic Transducer, optional 120kHz

2 Channel Independent Bonding Parameters

Built-In Digital Work Stage Temperature Control

Menu