We offer the following die attach / die sort systems from HANMI Semiconductor:

hanmi_flipchip_A110

Hanmi Die Sorter

FEATURES

High Productivity: Typically 10,000 UPH

Pick & Place Head with Theta-Compensation

Wafer Cassette Handler

  • Wafer Handling:
  • Programmable wafer stretch
  • Die ejection
    • Servo controlled Z (synchronous with pick head)
    • Ejector correction of +/- 5mm for fine correction

Automatic Die Pick-Up & Mounting Height Verification & Compensation

  • Voice coil motor for Z

Pick & Place Force Programmable Via Voice Coil Motor

Waffle Pak/GEL Pak Handling System (2-4″, or custom spec.)

  • Stack at input
  • Stack at output

Advanced Vision Inspection with High-Resolution Cameras

  • Vision engine – HANMI vision system
    • All parameters can be saved
  • Camera resolution: 640 x 480
  • Lens zoom: x0.4 ~ 0.6 (manual zoom)
  • FOV: 3 ~ 12mm
  • Illumination: Coaxial (RGB) + Size (RGB)
    • Light controller adjustable via screen

Quick & Easy Conversion (10 min. maximum)

Low Cost of Ownership

hanmi_diesorter

Hanmi LED Die Attach

FEATURES

High Productivity: 21,000 UPH (dry running speed only)

  • Dual epoxy writing head
  • Single die bonding head

Die Bonding Head with Theta-Compensation

Automatic Die Pick-Up & Mounting Height Checking with Compensation

Modular Concept for Inline Bonding

Advanced Vision Inspection with High-Resolution Cameras

Low Cost of Ownership

Quick & Easy Conversion

Hanmi Flip Chip Model FC Bonder - A110

Hanmi Flip Chip: Model FC Bonder – A110

FEATURES

Productivity: 10,000 UPH (dry running), 5,000 (real production)

High Accuracy: ± 7.0 microns @ 3σ (normal), ± 10.0 microns @ 3σ (pre-aligned)

Programmable Bonding Force: 1N ~ 25N

Die Size: 0.5 mm ~ 30.0 mm

Wafer Size: Up to 12″

The Most Advanced X-Y-Z Motion Controlled Bonding Head

Dual Flipper & Bond Head for High Mass Production

Precise Pick Up & Bonding Process Utilizing Vision Inspection

Improved Machine Productivity

SMEMA In-Line Capability

Hanmi Flip Chip Model FC Bonder - A110

Hanmi Flip Chip: Model FC Bonder – A110 Ultra

FEATURES

Productivity: 15,000 UPH (dry running), 5,000 (real production)

High Accuracy: ± 5.0 microns @ 3σ (normal), ± 10.0 microns @ 3σ (pre-aligned)

Programmable Bonding Force: 1N ~ 25N

Die Size: 0.5 mm ~ 30.0 mm

Wafer Size: Up to 12″

The Most Advanced X-Y-Z Motion Controlled Bonding Head

Dual Flipper & Bond Head for High Mass Production

Precise Pick Up & Bonding Process Utilizing Vision Inspection

Improved Machine Productivity

SMEMA In-Line Capability

Mass Defect Protection Capability

NDCI Hanmi Flip Chip Bonder S100

Hanmi Flip Chip: Model FC Bonder – S100

FEATURES

High Productivity

  • 15,000 UPH (Based on Dry Run)

Precision Bonding Capability

High Reliability

Precision Bonding Capability

High Reliability

  • One Casting Body Structure

Low Cost of Ownership

  • Economic Version of Flip Chip Bonder
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