NDC International offers the world’s leading pick and place machines for packaging including vision placement systems.
With over 80% world-wide market share, HANMI Semiconductor can provide multiple solutions for your pick and place equipment needs including vision placement applications such as BGA, QFN, MLP and large PCB’s.
We offer the following vision placement systems:
FEATURES
Individual operation dual chuck sawing process
Casting body for high durability & minimum vibration
Small unit handling
Supreme vision inspection
FEATURES
High Productivity: 20,000 UPH
Individually Operating Dual Chuck Sawing Process
Multiple Unit Handling System
Automatic Picker Pitch – Adjustment Function
Universal Unit Picker Pad
World’s #1 Technology in Sawing and Placement
Advanced Vision Inspection System
Enhanced Machine Features
FEATURES
Solution for Singulation of Large PCB Panels
High Productivity
Most Effective Cleaning
Machine Flexibility for Trays
Advanced Vision Inspection System
Enhanced Machine Features
