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Neu Dynamics will be at the International Microelectronics Assembly and Packaging Society (iMAPS) Conference 2026 in Phoenix, Arizona. We would…

Oct 6 – 9th, 2025 We are excited to meet you at The Battery Show and Electric & Hybrid Vehicle…

Are you attending IMAPS San Diego? Stop by Booth #622 to say hello and meet our friends from budatec. We…

Neu Dynamics is proud to represent budatec GmbH in the USA. We know you will be as excited as we…

We are excited to connect with you at the IMAPS conference in Phoenix, Arizona! Visit the Neu Dynamics team at…

We are looking forward to the IMAPS Advanced Packaging for Medical Microelectronics Workshop from March 5th to the 7th! Hope…

Neu Dynamics represents Boschman Advanced Packaging Technology in the Eastern United States. Boschman has been at the forefront of sintering…

MicroAssembly Technologies, Ltd. (MAT) was founded in 2000. With 35 years of experience, the folks at MAT deliver simple, flexible,…

In September, HANMI Semiconductor announced the launch of the 7th generation new micro SAW P2101 & VISION PLACEMENT 6.0 GRIFFIN.…

At the iMAPS show in Boston earlier this month, we had huge interest in budatec’s systems from power module manufacturers.…

Philadelphia, PA, October 25, 2024 – Neu Dynamics Corporation and NDC International (collectively “Neu Dynamics”) are pleased to announce their…

Philadelphia, PA, September 23, 2024 – Neu Dynamics Corp. (NDC) is pleased to announce the appointment of Nicholas Leonardi to…