See You in September
NDC will be exhibiting at the 29th Annual Electronics Packaging Symposium (EPS). This symposium which is offered by The Integrated Electronics Engineering Center (IEEC) is a component of the Small Scale Systems Integration and Packaging Center at Binghamton University.
The EPS is the preeminent electronics manufacturing conference in the Northeast. The symposium brings together the electronics packaging industry’s top talent and minds. This year EPS will be held at GE Global Research in Niskayuna, New York from September 19-20th and will offer keynote speakers, 40+ invited technical presentations by academic industry, exhibits and more.
Stop by and see us in the exhibit hall September 19 & 20th!
For more information and updated program, click here.
Registration closes September 12th. To register, click here.